Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling

Praveen Kumar; Victor Koledov; Svetlana von Gratowski; Rudra Pratap; Artemy Irzhak; Alexey Zhikharev; Andrey Orlov; Peter Lega; Santanu Talukder; Sumit Kumar; Vijayendra Shashtri

doi:10.1109/3M-NANO.2018.8552248

Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling

Praveen Kumar^*, Victor Koledov, Svetlana von Gratowski, Rudra Pratap, Artemy Irzhak, Alexey Zhikharev, Andrey Orlov, Peter Lega, Santanu Talukder, Sumit Kumar, Vijayendra Shashtri

^*Corresponding author for this work

Department of Molecular Chemistry and Materials Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

In the report the physical basis of the development of electrical nano-contacts for bottom-up nanointegration are studied. For the fabrication of the electrical nano-contacts it is proposed to use the electromigration of micro - and -nano-drops of metals and 3D mechanical nanomanipulation of the nanowires. Nano-manipulation is provided by the usage of nanotweezers, produced from shape memory alloy composite. The process of the melting of the micro-wires was studied under the action of laser radiation and heating.

Original language	English
Title of host publication	2018 IEEE INTERNATIONAL CONFERENCE ON MANIPULATION, MANUFACTURING AND MEASUREMENT ON THE NANOSCALE (3M-NANO) - CONFERENCE PROCEEDINGS
Editors	M Yu, ZK Weng
Pages	167-170
Number of pages	4
ISBN (Electronic)	9781538662144
DOIs	https://doi.org/10.1109/3M-NANO.2018.8552248
Publication status	Published - 2018
Event	IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) - Hangzhou, China Duration: 13 Aug 2018 → 17 Aug 2018 Conference number: 2018

Publication series

Series	2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2018 - Proceedings

Conference

Conference	IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)
Country/Territory	China
City	Hangzhou
Period	13/8/18 → 17/8/18

All Science Journal Classification (ASJC) codes

Industrial and Manufacturing Engineering
Mechanical Engineering
Instrumentation

Access to Document

10.1109/3M-NANO.2018.8552248

Cite this

Kumar, P., Koledov, V., von Gratowski, S., Pratap, R., Irzhak, A., Zhikharev, A., Orlov, A., Lega, P., Talukder, S., Kumar, S., & Shashtri, V. (2018). Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling. In M. Yu, & ZK. Weng (Eds.), 2018 IEEE INTERNATIONAL CONFERENCE ON MANIPULATION, MANUFACTURING AND MEASUREMENT ON THE NANOSCALE (3M-NANO) - CONFERENCE PROCEEDINGS (pp. 167-170). Article 8552248 https://doi.org/10.1109/3M-NANO.2018.8552248

Kumar, Praveen ; Koledov, Victor ; von Gratowski, Svetlana et al. / Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling. 2018 IEEE INTERNATIONAL CONFERENCE ON MANIPULATION, MANUFACTURING AND MEASUREMENT ON THE NANOSCALE (3M-NANO) - CONFERENCE PROCEEDINGS. editor / M Yu ; ZK Weng. 2018. pp. 167-170 (2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2018 - Proceedings).

@inproceedings{77bd5f4e723f4aad94cba06cc1949fb8,

title = "Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling",

abstract = "In the report the physical basis of the development of electrical nano-contacts for bottom-up nanointegration are studied. For the fabrication of the electrical nano-contacts it is proposed to use the electromigration of micro - and -nano-drops of metals and 3D mechanical nanomanipulation of the nanowires. Nano-manipulation is provided by the usage of nanotweezers, produced from shape memory alloy composite. The process of the melting of the micro-wires was studied under the action of laser radiation and heating.",

author = "Praveen Kumar and Victor Koledov and \{von Gratowski\}, Svetlana and Rudra Pratap and Artemy Irzhak and Alexey Zhikharev and Andrey Orlov and Peter Lega and Santanu Talukder and Sumit Kumar and Vijayendra Shashtri",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO) ; Conference date: 13-08-2018 Through 17-08-2018",

year = "2018",

doi = "10.1109/3M-NANO.2018.8552248",

language = "English",

series = "2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2018 - Proceedings",

pages = "167--170",

editor = "M Yu and ZK Weng",

booktitle = "2018 IEEE INTERNATIONAL CONFERENCE ON MANIPULATION, MANUFACTURING AND MEASUREMENT ON THE NANOSCALE (3M-NANO) - CONFERENCE PROCEEDINGS",

}

Kumar, P, Koledov, V, von Gratowski, S, Pratap, R, Irzhak, A, Zhikharev, A, Orlov, A, Lega, P, Talukder, S, Kumar, S & Shashtri, V 2018, Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling. in M Yu & ZK Weng (eds), 2018 IEEE INTERNATIONAL CONFERENCE ON MANIPULATION, MANUFACTURING AND MEASUREMENT ON THE NANOSCALE (3M-NANO) - CONFERENCE PROCEEDINGS., 8552248, 2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2018 - Proceedings, pp. 167-170, IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO), Hangzhou, China, 13/8/18. https://doi.org/10.1109/3M-NANO.2018.8552248

Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling. / Kumar, Praveen; Koledov, Victor; von Gratowski, Svetlana et al.
2018 IEEE INTERNATIONAL CONFERENCE ON MANIPULATION, MANUFACTURING AND MEASUREMENT ON THE NANOSCALE (3M-NANO) - CONFERENCE PROCEEDINGS. ed. / M Yu; ZK Weng. 2018. p. 167-170 8552248 (2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2018 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling

AU - Kumar, Praveen

AU - Koledov, Victor

AU - von Gratowski, Svetlana

AU - Pratap, Rudra

AU - Irzhak, Artemy

AU - Zhikharev, Alexey

AU - Orlov, Andrey

AU - Lega, Peter

AU - Talukder, Santanu

AU - Kumar, Sumit

AU - Shashtri, Vijayendra

N1 - Conference code: 2018

PY - 2018

Y1 - 2018

N2 - In the report the physical basis of the development of electrical nano-contacts for bottom-up nanointegration are studied. For the fabrication of the electrical nano-contacts it is proposed to use the electromigration of micro - and -nano-drops of metals and 3D mechanical nanomanipulation of the nanowires. Nano-manipulation is provided by the usage of nanotweezers, produced from shape memory alloy composite. The process of the melting of the micro-wires was studied under the action of laser radiation and heating.

AB - In the report the physical basis of the development of electrical nano-contacts for bottom-up nanointegration are studied. For the fabrication of the electrical nano-contacts it is proposed to use the electromigration of micro - and -nano-drops of metals and 3D mechanical nanomanipulation of the nanowires. Nano-manipulation is provided by the usage of nanotweezers, produced from shape memory alloy composite. The process of the melting of the micro-wires was studied under the action of laser radiation and heating.

UR - https://www.scopus.com/pages/publications/85059990920

U2 - 10.1109/3M-NANO.2018.8552248

DO - 10.1109/3M-NANO.2018.8552248

M3 - Conference contribution

T3 - 2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2018 - Proceedings

SP - 167

EP - 170

BT - 2018 IEEE INTERNATIONAL CONFERENCE ON MANIPULATION, MANUFACTURING AND MEASUREMENT ON THE NANOSCALE (3M-NANO) - CONFERENCE PROCEEDINGS

A2 - Yu, M

A2 - Weng, ZK

T2 - IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)

Y2 - 13 August 2018 through 17 August 2018

ER -

Kumar P, Koledov V, von Gratowski S, Pratap R, Irzhak A, Zhikharev A et al. Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling. In Yu M, Weng ZK, editors, 2018 IEEE INTERNATIONAL CONFERENCE ON MANIPULATION, MANUFACTURING AND MEASUREMENT ON THE NANOSCALE (3M-NANO) - CONFERENCE PROCEEDINGS. 2018. p. 167-170. 8552248. (2018 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale, 3M-NANO 2018 - Proceedings). doi: 10.1109/3M-NANO.2018.8552248

Electrical Jointing at Micro- and Nanoscale by Electromigration and Mechanical Nano-Manipulation for Bottom-Up Nano-Assembling

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