Method to control deposition rate instabilities - High power impulse magnetron sputtering deposition of TiO₂

Keyphrases

• Rutile 100%
• Deposition Rate 100%
• Magnetron Sputtering Deposition 100%
• HiPIMS 100%
• Shutter 60%
• Pulsed Power 60%
• TiO2 Deposition 40%
• Energy Levels 20%
• Film Thickness 20%
• Average Energy 20%
• Open-closed 20%
• Deposition Process 20%
• Geometry Modification 20%
• Plasma Condition 20%
• TiO2 Film 20%
• Magnetron 20%
• Plasma Instabilities 20%
• Plasma Gases 20%
• Pulse Waveform 20%
• Ti Target 20%
• Reactive Sputtering 20%
• Pulse Current 20%
• Ti Film 20%
• Plasma Impedance 20%
• Multilayer Heterostructure 20%
• Gas Rarefaction 20%

Engineering

• Deposition Rate 100%
• High Power Impulse Magnetron Sputtering 100%
• Pulse Energy 60%
• Energy Engineering 20%
• Magnetron 20%
• Heterostructures 20%
• Current Pulse 20%
• Rarefaction 20%
• Reactive Sputtering 20%
• Deposition Process 20%